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FR-4/CEM-3/CEM-1/ACCL
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Prepreg
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FCCL
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LED & PCB products
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Specification of HFW-C140
- Thickness HFW-C140 Copper Foil In Cluding Copper Not In Cluding Thickness Tolerance Standard(mil)
- mmmil
- 0.14 √ ±0.7
- 0.135 √ ±0.7
- 0.156 √ ±0.7
- 0.28 √ ±0.8
- 0.2510 √ ±1
- 0.312 √ ±1.2
- 0.3514 √ ±1.4
- 0.3815 √ ±1.5
- 0.416 √ ±1.5
- 0.520 √ ±2
- 0.624 1oz √ ±2
- 0.624 Hoz √ ±2
- 0.831 1oz √ ±3
- 0.831 Hoz √ ±3
- 0.935 1oz √ ±3
- 0.935 Hoz √ ±3
- 1.039 1oz √ ±3
- 1.039 Hoz √ ±3
- 1.143 1oz √ ±3
- 1.143 Hoz √ ±3
- 1.247 1oz √ ±3
- 1.247 Hoz √ ±3
- 1.351 1oz √ ±3
- 1.351 Hoz √ ±3
- 1.559 1oz √ ±4
- 1.559 Hoz √ ±4
- 1.663 1oz √ ±4
- 1.663 Hoz √ ±4
- 2.078 1oz √ ±7
- 2.078 Hoz √ ±7
- 2.494 1oz √ ±8
- 2.494 Hoz √ ±8
- 3.0118 1oz √ ±10
- 3.0118 Hoz √ ±10
Note:
1、We can supply materials size(Inch):37"*49"41*49"43*49",
2、At customer request, we can supply special performance materials.
Characters (HFW-C140 IPC-410/21)
- Item Unit Condition Spec Typical Value
- Glass Transition(Tg) ℃ E-2/105 135±5 138
- Flammability - UL94 V-0 PASS
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Peel Strength
Lb/in(N/mm)
Cond.A
1.7μ35μ
4.56
17μ35μ
68
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Thermal Stress(unetched)
Thermal Stress(etched)
Sec288℃
288℃
60Sec
30Sec
>90
>60
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Flexural Strength
LW N/mm²
CW N/mm²
A415↑
345↑
550
390
- Surface Resistance M Ω C-96/35/90 ＞10⁴ 10⁶
- Volume Resistance M Ω C-96/35/90 ≥10⁶ 10⁷
- Dielectric Constant - C-40/23/50 ≤5.4 4.5
- Loss Tangent(1 MHZ) - C-40/23/50 ≤0.035 0.02
- Moisture Absorption ％ D24/23 ≤0.35 0.15
- Z-CTE(≤Tg)α 1 ppm/℃ E-2/205 TMA - 45/60
- Z-CTE(≥Tg)α 1 ppm/℃ E-2/205 TMA - 280/320
- CTI V A - 175
- Dielectric Breakdown KV D-48/50 ≥40 50
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Arc Resistance
Sec
D-48/50
D-0.5/23
≥60 90 -
Wap
％
A ≥ 0.5mm
max = 300mm
≤1.0 0.3
Specification of CEM-3
- Thickness HFW-CEM3 Copper Foil In Cluding Copper Not In Cluding Thickness Tolerance Standard(mil)
- mmmil
- 1.039 √ ±3
- 1.247 √ ±4
- 1.559 √ ±5
Note:
1、We can supply materials size(Inch):37"*49"41*49"43*49",
2、At customer request, we can supply special performance materials.
Characters CEM-3
- Item Unit Condition Spec Typical Value
- Glass Transition(Tg) ℃ not applicable
- Flammability - UL94 V-0 PASS
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Peel Strength
Lb/in(N/mm)
Cond.A
1.7μ35μ
4.56
17μ35μ
68
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Thermal Stress(unetched)
Thermal Stress(etched)
Sec260℃
260℃
10Sec
10Sec
>30
>30
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Flexural Strength
LW N/mm²
CW N/mm²
A276↑
186↑
356
235
- Surface Resistance M Ω C-96/35/90 ＞10⁴ 10⁶
- Volume Resistance M Ω C-96/35/90 ≥10⁶ 10⁷
- Dielectric Constant - C-40/23/50 ≤5.4 4.5
- Loss Tangent(1 MHZ) - C-40/23/50 ≤0.035 0.02
- Moisture Absorption ％ D24/23 ≤0.5 0.25
- Dielectric Breakdown KV D-48/50 ≥40 50
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Arc Resistance
Sec
D-48/50
D-0.5/23
≥60 90 -
Wap
％
A≥0.5mm
max = 300mm
≤1.0 0.3
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Performance list of HFW-P140
- Fabric Style Resin Content (%) Gel Time (Sec) Resin Flow (%) Thickness (mil) Volatile (%) Remarks
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1080MR
1080HR
2113MR
2116LR
2116MR
2116HR
1506MR
1506HR
7628LR
7628MR
7628HR
1080HR
2116MR
2116HR
65±3
68±3
55±3
50±3
55±3
58±3
44±3
47±3
43±3
45±3
48±3
68±3
55±3
58±3
145±20
145±20
135±20
145±20
140±20
135±20
145±20
145±20
140±20
140±20
135±20
125±20
130±20
125±20
34±5
43±5
33±5
26±5
32±5
36±5
25±5
31±5
22±5
25±5
28±5
40±5
32±5
36±5
3.0mil±0.5
3.5mil±0.5
4.0mil±0.5
4.5mil±0.5
5.0mil±0.5
5.5mil±0.5
6.2mil±0.5
6.8mil±0.5
7.2mil±0.5
7.8mil±0.5
8.5mil±0.5
3.5mil±0.5
5.0mil±0.5
5.5mil±0.5
0.5↓Suitable for laminated composite
Suitable for aluminum substrate pressing
Note:
1、Data shown above are nominal values for reference only beacause the thickness of PP after press will be different on different status.
2、At customer request, we can produce special performance prepreg.
3、Storage conditions:①20±2℃ and 50% R.H.for 3 months 、②Max 5℃ for 6 months.
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FCCL Soft board
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LED Products
PCB Products
